Power chips are attached to exterior circuits via packaging, and their efficiency depends upon the assistance of the product packaging. In high-power situations, power chips are generally packaged as power components. Chip affiliation refers to the electric connection on the top surface area of the chip, which is generally light weight aluminum bonding cable in standard components. ^
Typical power module plan cross-section
Today, business silicon carbide power modules still mainly make use of the product packaging modern technology of this wire-bonded standard silicon IGBT component. They deal with problems such as huge high-frequency parasitical parameters, inadequate heat dissipation capability, low-temperature resistance, and insufficient insulation toughness, which limit using silicon carbide semiconductors. The display of superb performance. In order to address these troubles and completely manipulate the significant possible benefits of silicon carbide chips, many new packaging innovations and remedies for silicon carbide power modules have actually emerged in recent years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have developed from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually created from gold wires to copper cords, and the driving pressure is price reduction; high-power tools have actually created from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to boost product performance. The better the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that makes use of a strong copper bridge soldered to solder to attach chips and pins. Compared with standard bonding packaging techniques, Cu Clip innovation has the following advantages:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a specific level, changes the common cord bonding technique between the chip and the pins. Consequently, a distinct package resistance worth, greater existing circulation, and better thermal conductivity can be obtained.
2. The lead pin welding area does not require to be silver-plated, which can totally conserve the cost of silver plating and inadequate silver plating.
3. The item appearance is entirely regular with normal items and is mostly used in servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power products, and various other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding method
Both eviction pad and the Source pad are clip-based. This bonding method is more expensive and intricate, yet it can accomplish much better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cord bonding method
The source pad uses a Clip approach, and eviction uses a Wire approach. This bonding technique is somewhat less costly than the all-copper bonding technique, saving wafer area (suitable to really tiny gateway areas). The process is easier than the all-copper bonding method and can obtain much better Rdson and far better thermal result.
Supplier of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding flat copper strip, please feel free to contact us and send an inquiry.
Inquiry us